Texas Instruments has introduced two isolated power modules that use its new IsoShield packaging technology to raise power density in applications including EVs and data centers.
The new UCC34141-Q1 and UCC33420 modules combine a planar transformer and isolated power stage in a single multichip package. TI says the approach can deliver up to three times the power density of discrete isolated-power designs while shrinking solution size by as much as 70%. The modules can provide up to 2 W of power and support functional, basic and reinforced isolation.
TI is pitching the parts for distributed power architectures, where isolation and fault tolerance matter. In EVs, that can help engineers design lighter and more efficient systems; in data centers, it’s about cramming more power into smaller footprints without giving up safety or reliability. The company says the packaging approach can also help avoid single-point failures in functional-safety-oriented designs.
The UCC34141-Q1 is a mid-voltage device covering 6 V to 20 V in a 5.85 mm x 7.5 mm x 2.6 mm package, while the UCC33420 is a low-voltage 5 V module in a 4 mm x 5 mm x 1 mm package. Both are available now, with evaluation modules, reference designs, and simulation models.
Source: TI
