Residue-free pastes provide tackiness and printability, and do not leave residues behind after reflow. The advantage is a noticeable cost saving, as there is no need to clean the substrates after soldering.
Residue-free pastes do not contain any activators. Therefore, formic acid must be used to deoxidize the solder powder and the interconnect surfaces for successful soldering. Residue-free pastes also release significantly more volatiles than resin-based solder pastes, which require special handling of the volatiles in the oven, e.g., to avoid frequent maintenance.
Join this webinar at next week’s Virtual Conference, presented by PINK GmbH Thermosysteme, where we will discuss the properties of residue-free pastes and technical solutions for vacuum reflow equipment.
September 16, 2025, 9:30 am EDT
Register now—it’s free!
See the complete session list for the Virtual Conference on EV Engineering here.
Broadcast live from September 15 to 18, 2025, the conference content will encompass the entire EV engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC and more.
