ROHM has expanded its lineup of low-voltage (40 V, 60 V) automotive MOSFETs by introducing new devices in a compact HPLF5060 package (4.9 mm × 6.0 mm). The company is positioning the parts for applications such as main inverter control circuits, electric pumps and LED headlights.
As low-voltage MOSFET packaging trends smaller—toward 5060-size and below—ROHM says board-mount reliability can suffer due to narrow terminal spacing and leadless designs. The new HPLF5060 package is meant to address that tradeoff: it has a smaller footprint than the widely used TO-252 (6.6 mm × 10.0 mm) package, and uses gull-wing leads to improve mounting reliability. ROHM also says copper clip junction technology enables high-current operation.
Mass production of the HPLF5060-based products began in November 2025, and ROHM says online sales have started, including availability via distributors such as DigiKey and Farnell.
Next up, ROHM says it plans to start mass production around February 2026 of its smaller DFN3333 (3.3 mm × 3.3 mm) package using wettable flank technology, and has begun development of a larger TOLG (TO-leaded with gull-wing) package (9.9 mm × 11.7 mm) aimed at high-power, high-reliability applications.
Source: ROHM
